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24 open roles read nightly from companies’ own hiring pages. Each one links to the original ad.

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  • Packaging Engineer- Materials

    3 months ago

    Volantis Semiconductor, Inc. · San Francisco, California, United States +2

    HybridEngineering

    Seeking an experienced engineer to lead wafer level mold and underfill process development for advanced semiconductor packages (fan-out wafer level packaging, 2.5D/3D, chiplet). This role spans

  • Packaging Engineer- Bump Interconnect

    3 months ago

    Volantis Semiconductor, Inc. · San Francisco, California, United States +2

    HybridEngineering

    Own end-to-end bump interconnect development for both ubump (micro-bump) and C4

  • Micro-Optics Engineer

    3 months ago

    Volantis Semiconductor, Inc. · San Francisco, California, United States +2

    HybridEngineering

    We are seeking a Senior Micro-Optics/Microlens Array Engineer to design, model, and validate microlens-array and wafer-level micro-optical components for high-density photonic packages. You will translate system-level optical requirements into manufacturable designs, build…

  • Advanced Packaging Engineer

    3 months ago

    Volantis Semiconductor, Inc. · San Francisco, California, United States +2

    Hybrid$250K – $400K a yearEngineering

    You will contribute to and own aspects of the Volantis A-0 and A-1 package.

Updated 07 Nov 2026 10:21 UTC from the OptiTalent job library.